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Description
Absolute Maximum Ratings(1),(2). Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-. FFB5551 : NPN Multi-Chip General Purpose Amplifier. For complete documentation, see the data sheet. FFB5551 . Features. This device is deisgned for general Thermal Resistance, Junction to Case. R JC. 83.3. C/W. Stresses exceeding Maximum Ratings may damage the device. Maximum. Ratings are stress ratings free. Active. NPN & PNP General Purpose. Amplifier. SC-88-6 /. SC-70-6 /. SOT- 363-. 6. FFB5551 . Pb-free. Halide free. Active. NPN Multi-Chip General Purpose. NPN/PNP. Hybrid. 40. 40. 5. 0.2. 100. 300. 1. 10. 0.25. 10. 1. SC70. FFB5551 . NPN. Hybrid. 160. 180. 6. 0.2. 80. 250. 5. 10. 1. 50. 5. SC70. MMPQ2222. NPN.
| Part Number | FFB5551 |
| Main Category | Discrete Semiconductor Products |
| Sub Category | Transistors - Bipolar (BJT) - Arrays |
| Brand | ON Semiconductor |
| Description | TRANS 2NPN 160V 0.2A SC70-6 |
| Series | - |
| Packaging | Cut Tape (CT) |
| Transistor Type | 2 NPN (Dual) |
| Current - Collector (Ic) (Max) | 200mA |
| Voltage - Collector Emitter Breakdown (Max) | 160V |
| Vce Saturation (Max) @ Ib, Ic | 200mV @ 5mA, 50mA |
| Current - Collector Cutoff (Max) | 50nA (ICBO) |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 80 @ 10mA, 5V |
| Power - Max | 200mW |
| Frequency - Transition | 300MHz |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 6-TSSOP, SC-88, SOT-363 |
| Supplier Device Package | SC-70-6 |
| Image |  |
FFB5551
ONSEMICON
30316
0.41
HK HEQING ELECTRONICS LIMITED
FFB5551
ON/ST
5000000
1.4375
Hongkong Shengshi Electronics Limited
FFB5551
ON/CMD
55300
2.465
WEISOK ELECTRONICS (HK) TECHNOLOGY LIMITED
FFB5551
ON/SANYO
55
3.4925
FLOWER GROUP(HK)CO.,LTD
FFB5551
ONSEM
16773
4.52
HK TWO L ELECTRONIC LIMITED
